Nanotechnology is the latest promising technology for future that has many potential and actual applications in nanoelectronic devices. However, to gain advantages on nanotechnology is required a sophisticated technology itself. The main problems of nanoelectronic device fabrication are small scale, small area, small volume and low concentration. Manufacturing in nano scale creates issues not only on performance, but also cost for the electronics industry. To overcome this problem, we studied a profiling of metal contact. We present the aluminum (Al) profiling in order to get desired properties as well as effective in cost, since aluminum is widely used in many electronic applications like spintronics, solar cell, thin film transistors, and even for photocatalyst. In this research, the Al was deposited by thermal vacuum evaporator. The structural properties of Al films were characterized using XRD, AFM, and FESEM. The electrical properties were characterized using Four-point probe. The results show increasing the thickness result in decreasing both the resistivity and the strain of the Al films as well as increasing the cost.
